Máquina da eletrônica X Ray
Equipamento de testes de empacotamento da microplaqueta do semicondutor do raio X AX9100 UNICOMP da ruptura do fio da ligação de IC da imagem latente de 7μm
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & ...
Raio X UNICOMP AX9100 LED de produção de chip de ampliação geométrica precisa de detecção rotativa
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time ...
Máquina de raios-X de PCB de alta ampliação Unicomp AX9100MAX para componentes eletrônicos IC inspeção de fio de ligação
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive ...
Máquina de raio X eletrônica programável CNC de inspeção automática Unicomp AX9100MAX para medição de curvatura IC
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. ...
Máquina de raio X SMT PCB tamanho de ponto de foco de mícron de alta resolução Unicomp AX9100MAX para medição de vazios BGA
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer ...
Máquina de raios-X de tubo de tamanho de ponto de foco de 130KV micron Unicomp AX9100MAX com dois computadores para inspeção de PCB BGA
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature ...
Placas eletrônicas de altas especificações 2D 2.5D máquina de raio X Unicomp AX9100MAX com mesa de rotação de 360 graus
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides ...
Equipamento de raio X Unicomp AX8300 para controle de qualidade, detecção automática de vazios, alta precisão de movimento BGA
Unicomp AX8300 X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it provides balanced ...
Equipamento do sistema de controle de qualidade AX8300 Unicomp da junção da solda da elevada precisão BGA
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
