logo
Bem-vindo ao Unicomp Technology
+86-13502802495

Máquina da eletrônica X Ray

Qualidade Componentes autônomos Desktop da eletrônica do tempo real X Ray Machine High Precision For Fábrica

Componentes autônomos Desktop da eletrônica do tempo real X Ray Machine High Precision For

Desktop Offline Real Time X-Ray Machine High Precision For Electronics Components​ OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to
Qualidade Unicomp Sistema de Inspeção de Análise de Raios X AX9100vs Multimodo 3D Microfoco Fábrica

Unicomp Sistema de Inspeção de Análise de Raios X AX9100vs Multimodo 3D Microfoco

Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Qualidade Fontes 100KV do poder superior X Ray da máquina da eletrônica X Ray do diodo emissor de luz do PWB SMT BGA Fábrica

Fontes 100KV do poder superior X Ray da máquina da eletrônica X Ray do diodo emissor de luz do PWB SMT BGA

PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging
Qualidade Máquina de raios-X 2D e 2.5D de alta especificação com mesa de rotação de 360 graus para inspeção de BGA e PCB Fábrica

Máquina de raios-X 2D e 2.5D de alta especificação com mesa de rotação de 360 graus para inspeção de BGA e PCB

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Qualidade Máquina de raios-X de PCB SMT Unicomp AX9100MAX Alta Resolução Micron Focal Spot Dimensão para BGA Vaids e Inspeção de pasta de solda Fábrica

Máquina de raios-X de PCB SMT Unicomp AX9100MAX Alta Resolução Micron Focal Spot Dimensão para BGA Vaids e Inspeção de pasta de solda

It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Qualidade Placas eletrônicas Máquina de raios-X 2D e 2.5D AX9100MAX Com Tabela de Rotação de 360 Graus Para BGA&PCB Fábrica

Placas eletrônicas Máquina de raios-X 2D e 2.5D AX9100MAX Com Tabela de Rotação de 360 Graus Para BGA&PCB

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Qualidade Máquina de raios X de tubo de tamanho de ponto de foco de 130KV AX9100MAX com computadores duplos para inspeção de PCB e BGA Fábrica

Máquina de raios X de tubo de tamanho de ponto de foco de 130KV AX9100MAX com computadores duplos para inspeção de PCB e BGA

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Qualidade Inspecção automática CNC programável Máquina eletrónica de raios-X AX9100MAX com ângulo de inclinação de 60° para medição da curvatura do IC Fábrica

Inspecção automática CNC programável Máquina eletrónica de raios-X AX9100MAX com ângulo de inclinação de 60° para medição da curvatura do IC

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Qualidade Máquina de raios-X de PCB de alta ampliação Unicomp AX9100MAX para componentes eletrônicos IC inspeção de fio de ligação Fábrica

Máquina de raios-X de PCB de alta ampliação Unicomp AX9100MAX para componentes eletrônicos IC inspeção de fio de ligação

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.