Máquina da eletrônica X Ray
Sistema de raios-X AX9100max com Algoritmos para Reconstrução de Imagem de Super-Resolução
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
AX9100max Máquina de raios X Eletrônicos Com Seguimento de Ponto Fixo Durante a Inclinação FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Sistema de raios-X Unicomp AX9100max para inspecção de defeitos internos de componentes electrónicos
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Máquina de raios X de tubo de tamanho de ponto de foco de 130KV Micron Unicomp AX9100 Modelo atualizado AX9100MAX com computadores duplos para inspeção de PCB e BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Unicomp AX9100 X Ray Inspection Equipment 130KV fechou a imagem do tubo FPD para BGA PCBA
Unicomp AX9100 130KV closed tube X-ray with FPD image detector for BGA,PCBA,Diode and semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Tabela oblíqua da rotação da opinião 360 da eletrônica X Ray Machine With FPD de AX9100 130kV Microfocus
AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
Máquina de raio X alta autônoma AX9100 do microfocus 130kV da penetração de Unicomp para a inspeção de solda da qualidade do processador central IC de SMT PCBA
Unicomp offline high penetration microfocus 130kV Xray machine AX9100 for SMT PCBA CPU IC soldering quality inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Máquina de raios-X de PCB de alta ampliação Unicomp AX9100MAX para componentes eletrônicos IC inspeção de fio de ligação
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Máquina de raio X de alta resolução AX8200MAX para a inspeção interna dos defeitos da microplaqueta de Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
