industrial x ray systems
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Sistema de raios X de NDT industrial em tempo real de 160 KV para fundições de alumínio com certificação CE/FCC
NDT UNS160 X Ray Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal castings hardware products plastic products refractory materials resin materials review conduct non-destructive testing on various small and micro products such as materials FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How about the
Máquina de inspecção de raios-X da articulação do volante Unicomp UNZ225 225KV NDT Máquina de radiografia digital para rachaduras internas
Steering knuckle X-ray inspection machine Unicomp UNZ225 225KV NDT digital radiagraphy machine for internal cracks The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. Product Features The pallet inspection platform can
Sistema de escaneador de raios-X de alimentos inteligentes de alta precisão Unicomp UNX6030N para alimentos nutricionais embalados em grandes quantidades
High accuracy intelligent food X-ray scanner system Unicomp UNX6030N for big packaged nutrition food APPLICATION UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. FEATURES Easy to Operate: one button start&stop, optional default product Provide high precision automatic
Unicomp UNX6030N Máquina de detecção de aço de raios X para alimentos Inspecionar objetos estranhos como aço, cerâmica, pedra, ossos, vidro
Unicomp UNX6030N food X ray steel detector machine inspect the foreign objects as steel,ceramic,stone,bones,glass APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES User-Friendly Operation: Features a
Máquina de raios-X de PCB de alta ampliação Unicomp AX9100MAX para componentes eletrônicos IC inspeção de fio de ligação
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Medição de curvatura IC Máquina de raios-X Unicomp AX9100MAX com tamanho de pixel de 84μm e ângulo de inclinação de 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
Máquina de raios-X de PCB SMT Unicomp AX9100MAX Alta Resolução Micron Focal Spot Dimensão para BGA Vaids e Inspeção de pasta de solda
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Máquina de raios X de tubo de tamanho de ponto de foco de 130KV Micron Unicomp AX9100 Modelo atualizado AX9100MAX com computadores duplos para inspeção de PCB e BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Máquina de raios-X de tubo de tamanho de ponto de foco de 90KV Micron Modelo AX7900 atualizado da Unicomp com computadores duplos para verificar a qualidade do celular
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
