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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Propriedades Básicas
Local de Origem: China
Marca: UNICOMP
Certificação: CE, FDA
Número do modelo: AX8300MAX
Propriedades comerciais
Quantidade mínima de pedido: 1 conjunto
Preço: can negotiate
Condições de pagamento: T/T,L/C
Capacidade de fornecimento: 30 conjuntos por mês
Resumo do Produto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Detalhes do produto

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Unicomp AX8300MAX X-ray inspection machine

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BGA automated void detection X-ray

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110KV X-ray machine for electronics

Motion Control Mode: Mouse, teclado e joystick
Tilt And Rotation: Inclinação unilateral do detector máxima 60°
Monitor: Tela HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Descrição do produto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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