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110KV X-ray Inspection for BGA with AI-Powered Automatic Void Detection Unicomp AX8300MAX

Propriedades Básicas
Local de Origem: China
Marca: UNICOMP
Certificação: CE, FDA
Número do modelo: AX8300MAX
Propriedades comerciais
Quantidade mínima de pedido: 1 conjunto
Preço: can negotiate
Condições de pagamento: T/T,L/C
Capacidade de fornecimento: 30 conjuntos por mês
Resumo do Produto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Detalhes do produto

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110KV X-ray BGA inspection machine

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AI-powered automatic void detection X-ray

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Unicomp AX8300MAX X-ray electronics

Model: AX8300MAX
Motion Control Mode: Mouse, teclado e joystick
Tilt And Rotation: Inclinação unilateral do detector máxima 60°
Monitor: Tela HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Tube Type: Selado
Descrição do produto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic
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