Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Propriedades Básicas
Local de Origem:
China
Marca:
UNICOMP
Certificação:
CE, FDA
Número do modelo:
AX9100max
Propriedades comerciais
Quantidade mínima de pedido:
1 conjunto
Preço:
can negotiate
Condições de pagamento:
L/C,T/T
Capacidade de fornecimento:
100set/montrh
Resumo do Produto
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Detalhes do produto
Destacar:
Unicomp AX9100max X-ray inspection system
,Flip-Chip BGA X-ray machine
,FCBGA packaging analysis equipment
Monitor:
Tela HD de 27"
System OS:
Windows10 64 bits
Hard Disk:
1TB
RAM:
16G
CPU Model:
I7
Descrição do produto
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
- BGA/CSP/Flip Chip packaging
- LED & optoelectronic components
- Fuse & diode manufacturing
- PCB & semiconductor assembly
- Battery production
- Small metal castings
- Electronic connector modules & cables
- Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Classificação geral
de 5 estrelas
100%
4 estrelas
0
3 estrelas
0
2 estrelas
0
1 estrela
0
Todos os comentários
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